The modern world relies on connectivity - both wired and wireless. Chips, particularly RF chips, enable this connectivity. RF chips are continuously supporting more features, functions and frequency bands. A complex RF chip will often include different functions and semiconductor technologies as a system in package (SIP).

When verifying the features of each element and semiconductor, testing is performed to verify individual function blocks before costly integration and packaging. During the production process, early testing is conducted on the wafer or die.

Rohde & Schwarz provides cutting-edge instruments that ensure fast and accurate on-wafer and die testing. We also collaborate with leading probe station specialists for sophisticated RF probing.